Samsung Foundry to produce AMD Zen 5c chips on 4nm process

Samsung Foundry will manufacture AMD’s next‑generation “Zen 5c” processors on a 4nm process, complementing AMD’s parallel order with TSMC for the same family on a 3nm node [1]. The move signals AMD’s intent to diversify its supply chain ahead of the first Zen 5 products slated for 2024 [1].

Multi‑foundry approach for Zen 5c

AMD’s order with Samsung covers the “base” versions of the Zen 5c line, which are expected to be built on Samsung’s 4nm process. At the same time, AMD has placed a separate order with TSMC for the “advanced” Zen 5c chips that will use a 3nm node, according to Tom’s Hardware [1]. This dual‑fab strategy mirrors AMD’s recent practice of spreading risk across manufacturers and leveraging the best‑available process nodes for different product tiers.

Implications for the CPU market

The split between 4nm (Samsung) and 3nm (TSMC) mirrors the broader industry trend of using multiple foundries to meet demand spikes and mitigate supply‑chain disruptions. Samsung’s involvement gives the company a foothold in the high‑performance x86 market, traditionally dominated by TSMC, and could intensify competition for future process‑node contracts. For AMD, the arrangement allows it to ship a broader product mix—base‑line Zen 5c parts on 4nm and higher‑end, power‑optimized variants on 3nm—potentially improving yield and time‑to‑market ahead of the 2024 launch of the first Zen 5 CPUs [1].

What to watch

• Production ramp‑up – Monitor Samsung’s first silicon samples from the 4nm Zen 5c line, expected in the coming months.
• Performance benchmarks – Compare early performance data of Samsung‑fabbed 4nm Zen 5c chips against TSMC‑fabbed 3nm counterparts once they become available.
• Supply‑chain signals – Watch AMD’s quarterly updates for any shifts in fab allocation that could indicate changes in demand or yield expectations.

Samsung’s entry into AMD’s flagship CPU roadmap underscores the growing importance of multi‑foundry strategies as manufacturers chase ever‑smaller nodes. How the 4nm Zen 5c parts perform relative to their 3nm siblings will shape both AMD’s product positioning and the competitive dynamics between Samsung and TSMC in the high‑end processor market.